What is Cu clip package? copper cu

Apr 23,2024

Power chips are attached to exterior circuits through product packaging, and their efficiency depends upon the support of the product packaging. In high-power scenarios, power chips are normally packaged as power modules. Chip affiliation describes the electric link on the upper surface area of the chip, which is usually aluminum bonding wire in conventional modules. ^
Standard power component plan cross-section

Today, industrial silicon carbide power components still mostly utilize the product packaging modern technology of this wire-bonded typical silicon IGBT component. They encounter issues such as big high-frequency parasitic parameters, insufficient warmth dissipation ability, low-temperature resistance, and inadequate insulation stamina, which restrict the use of silicon carbide semiconductors. The screen of exceptional performance. In order to fix these issues and totally make use of the big potential advantages of silicon carbide chips, many new packaging innovations and remedies for silicon carbide power components have emerged recently.

Silicon carbide power module bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually created from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold wires to copper cables, and the driving pressure is price reduction; high-power devices have actually created from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product performance. The better the power, the greater the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared to typical bonding packaging methods, Cu Clip innovation has the adhering to advantages:

1. The link between the chip and the pins is constructed from copper sheets, which, to a certain extent, changes the common cable bonding technique in between the chip and the pins. Consequently, an one-of-a-kind package resistance worth, higher current circulation, and much better thermal conductivity can be acquired.

2. The lead pin welding area does not need to be silver-plated, which can totally conserve the expense of silver plating and bad silver plating.

3. The item appearance is totally consistent with regular items and is primarily made use of in web servers, mobile computers, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.

Cu Clip has 2 bonding approaches.

All copper sheet bonding approach

Both the Gate pad and the Resource pad are clip-based. This bonding method is more costly and intricate, however it can attain far better Rdson and better thermal impacts.

( copper strip)

Copper sheet plus wire bonding approach

The resource pad uses a Clip approach, and eviction utilizes a Cable approach. This bonding technique is a little cheaper than the all-copper bonding method, conserving wafer location (relevant to extremely tiny entrance locations). The procedure is less complex than the all-copper bonding technique and can get much better Rdson and far better thermal impact.

Supplier of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper cu, please feel free to contact us and send an inquiry.

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